Options
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Now showing
1 - 7 of 7
-
PublicationReliability of Several Sn-Based Solders under Test- and Field Fatigue Loadings( 2008)
;Dudek, R. ;Ratchev, R. ;Faust, W.Michel, B. -
PublicationInvestigations of Reliability of Lead-Free Solder Joints( 2008)
;Faust, W. ;Poller, T. ;Dudek, R.Michel, B. -
-
PublicationIn-situ Microscopic Studies on Microstructural Degradation and FE Analyses for Miniaturized SAC Solder Joints under Thermal Test- and Field Cycling( 2007)
;Dudek, R. ;Faust, W. ;Döring, R.Michel, B. -
PublicationReliability Analyses of Pb- and SnAgCu Solder Interconnects at Ceramic Quartz Components Subjected to Several test and Field Conditions( 2005)
;Dudek, R. ;Döring, R. ;Michel, B. ;Picault, A.Autissier, J.-F. -
PublicationLead-free flip-chip solder interconnects - materials mechanics and reliability issues( 2001)
;Schubert, A. ;Dudek, R. ;Walter, H. ;Jung, E. ;Gollhardt, A.Michel, B. -
PublicationStudies on parameters for popcorn cracking( 2001)
;Dudek, R. ;Walter, H. ;Michel, B. ;Alpern, P. ;Schmidt, R.Tilgner, R.