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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Reliability of Several Sn-Based Solders under Test- and Field Fatigue Loadings
In-situ Microscopic Studies on Microstructural Degradation and FE Analyses for Miniaturized SAC Solder Joints under Thermal Test- and Field Cycling
Studies on parameters for popcorn cracking
Investigations of Reliability of Lead-Free Solder Joints
Reliability Analyses of Pb- and SnAgCu Solder Interconnects at Ceramic Quartz Components Subjected to Several test and Field Conditions
Lead-free flip-chip solder interconnects - materials mechanics and reliability issues