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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
On the crack and delamination risk optimization of a Si-interposer for LED packaging
Simulation Based Analysis of Secondary Effects on Solder Fatigue
Investigations of Reliability of Lead-Free Solder Joints
Thermal test- and field cycling induced degradation and its Fe-based prediction for different SAC solders
On the crack and delamination risk optimization of a Si-interposer for LED packaging
Micro- and nanoreliability research in the micro materials center Chemnitz of Fraunhofer ENAS
FEA Based Reliability Prediction for Different Sn-Based Solders Subjected to Fast Shear and Fatigue Loadings
Simulation based analysis of secondary effects on solder fatigue
Reliability of Several Sn-Based Solders under Test- and Field Fatigue Loadings
Challenges for multi-scale modeling of multiple failure modes in microelectronics packaging