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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Fan-Out Wafer and Panel Level Packaging - A Platform for 3D Integration
Panel Level Packaging for Component Integration of an Energy Harvesting System
A numerical study on mitigation of flying dies in compression molding of microelectronic packages
Panel Level Packaging: A View Along the Process Chain
Ferrites in Transfer-Molded Power SiPs: Challenges in Packaging
Process optimization and implementation of online monitoring process in the transfer molding for electronic packaging
Numerische und experimentelle Betrachtung des Molded Underfills
On the feasibility of fan-out wafer-level packaging of capacitive micromachined ultrasound transducers (CMUT) by using inkjet-printed redistribution layers
Panel Level Packaging - From Idea to Industrialization -
Die Realisierung von Umverdrahtungslagen mittels Inkjet-Printing im Fan-Out Wafer Level Packaging