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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Ferrites in Transfer-Molded Power SiPs: Challenges in Packaging
In-situ measuring module for transfer molding process monitoring
Thermo-mechanical reliability during technology development of power chip-on-board assemblies with encapsulation
On the feasibility of fan-out wafer-level packaging of capacitive micromachined ultrasound transducers (CMUT) by using inkjet-printed redistribution layers
High viscosity paste dosing for microelectronic applications
A numerical study on mitigation of flying dies in compression molding of microelectronic packages
Transfer molding technology for smart power electronics modules: Materials and processes