Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM

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  • Patent
    Kontaktlose Chipkarte
    ( 2003)
    Azdasht, G.
    ;
    Lange, M.
    The chip card (10) has an insulating substrate (12) in which a semiconductor chip (14) is incorporated, together with a coil structure (18) coupled to the semiconductor chip. The connections between the semiconductor chip and the coil structure are formed integral with the latter, with the semiconductor chip recessed into the substrate surface, so that the main surface of the chip lies flush with the substrate surface. USE - For key card used for door or automobile lock. ADVANTAGE - Eliminates need for bonded connections.
  • Patent
    Vorrichtung und Verfahren zum Aufbringen einer Mehrzahl von Lotkugeln auf ein Substrat
    ( 2001)
    Azdasht, G.
    ;
    Azadeh, R.
    ;
    Ruethnick, C.
    ;
    Lange, M.
    The apparatus for placing several solder balls onto a substrate incorporates a solder ball holding element (10) which channels (12) whose diameter is smaller than the diameter of the solder balls to be held. It further incorporates optical fibres (22) and an element (16) for holding them. This element is positioned so that the fibres are oriented in the direction of the respective channels in the ball holding element. The chamber (18) formed between the elements (10) and (16) can be put under a reduced pressure. The method consists of picking up and holding of solder balls as a result of reduced pressure in the chamber (18), positioning and release of them on a substrate, and melting of them by means of laser pulses through the channels (12). ADVANTAGE - Less time is required for such operations. Need for flux is obviated.
  • Patent
    Verfahren und Vorrichtung zum flussmittelfreien Aufbringen eines Loetmittels auf ein Substrat oder einen Chip
    ( 2001)
    Azdasht, G.
    ;
    Lange, M.
    Flux-free application of a solder sphere (102) to a substrate (104) or a chip (108) involves: (a) preliminary treatment and/or cleaning of a region (140) of the surface to be provided with a solder sphere; (b) isolation of the region (140) by means of protective gas from the surroundings; (c) application of a solder sphere to this region. Also claimed is an apparatus for implementation of the method. USE - Used in manufacture of electronic components, for soldering within the so-called fine pitch range. ADVANTAGE - Solder can be applied to substrate or chip surface without use of flux agents.
  • Patent
    Verfahren zum Anbringen von Laserdioden an einem Traeger und Laserdioden-Traeger-Anordnung
    ( 1998)
    Azdasht, G.
    ;
    Lange, M.
    ;
    Ruethnick, C.
    The method includes placing the laser diode (16,18) on the carrier over an extrusion (14,14'; 22) of the carrier in such a way, that two distant areas of the laser diode are arranged on at least two opposite sides of the extrusion, and mechanically and electrically connecting the areas of the laser diode with the carrier. A micro cooling arrangement (10,10'; 24) with a cooling channel is preferably used as the carrier, whereby the extrusion is formed through an aperture of the cooling channel at the surface of the micro cooling arrangement. ADVANTAGE - Provides simplified method which assures minimum mechanical stress on laser diode.