Verfahren zum Anbringen von Laserdioden an einem Traeger und Laserdioden-Traeger-Anordnung

The method includes placing the laser diode (16,18) on the carrier over an extrusion (14,14'; 22) of the carrier in such a way, that two distant areas of the laser diode are arranged on at least two opposite sides of the extrusion, and mechanically and electrically connecting the areas of the laser diode with the carrier. A micro cooling arrangement (10,10'; 24) with a cooling channel is preferably used as the carrier, whereby the extrusion is formed through an aperture of the cooling channel at the surface of the micro cooling arrangement. ADVANTAGE - Provides simplified method which assures minimum mechanical stress on laser diode.