Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM

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  • Publication
    Large area mold embedding technology with PCB based redistribution
    ( 2012)
    Braun, T.
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    Becker, K.-F.
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    Böttcher, L.
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    Ostmann, A.
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    Jung, E.
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    Voges, S.
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    Thomas, T.
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    Kahle, R.
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    Bader, V.
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    Bauer, J.
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    Aschenbrenner, R.
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    Schneider Ramelow, M.
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    Lang, K.-D.
    The constant drive to further miniaturization and heterogeneous system integration leads to a need for new packaging technologies which also allow large area processing and 3D integration with potential for low cost applications. Large area mold embedding technologies and embedding of active components into printed circuit boards (Chip-in-Polymer) are two major packaging trends in this area.
  • Publication
    Biocompatible lab-on-substrate technology platform
    ( 2009)
    Braun, T.
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    Böttcher, L.
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    Bauer, J.
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    Bocchi, M.
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    Faenza, A.
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    Guerrieri, R.
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    Gambari, R.
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    Becker, K.-F.
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    Jung, E.
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    Ostmann, A.
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    Koch, M.
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    Kahle, R.
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    Aschenbrenner, R.
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    Reichl, H.
    Multiwell plates in combination with optical inspection equipment are standard tools for biological and biomedical applications e.g. cell-to-cell interaction studies for cancer treatment. Microtechnology based multiwell plates have the potential to monitor physiological cellular interactions at single cell level with a high throughput e.g. for immunotherapy of cancer or targeted drug delivery, where each patient would receive drugs that are known to be useful for his/her specific situation. A Lab-On-Substrate technology platform based on standard PCB technology has been developed for cost-effective fabrication of biological and medical test devices. And as typical PCB laminates, mainly with copper as conductive material, are not biocompatible, a new material base has been identified and evaluated. The long and short time biocompatibility of promising materials including surface treatments have been studied in-vitro. Aluminum, polyimide and Pyralux have been selected as materials with focus on their bio- and process compatibility. A process flow consisting of lamination, Al structuring by wet etching, microwell and via formation by laser drilling and via metallization was developed based on standard PCB processes. These technologies allow a combination of large area and fine structuring for electrode and microwell realization. Furthermore, surface modifications of different materials by both chemicals such as thiols and fluorinated acrylates and plasma treatment were inspected by surface tension and wetting analysis to allow designing the hydrophilicity / hydrophobicity microfluidics networks required for the microwell device. A long-term stability at standard atmosphere conditions of at least one year of these coatings was also found. The technology was demonstrated with a dielectrophoresis enhanced microwell device for single cell handling and detection of cell-to-cell interaction as needed for the improvement of tumor therapy. In summary this paper describes the proof of concept using PCB manufacturing processes with biocompatible materials for the realization of an electrically enhanced microwell plate. Outcome of the technology developments is a Lab-On-Substrate technology platform for a variety of biomedical applications.
  • Publication
    Lab-on-substrate technology platform
    ( 2009)
    Braun, T.
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    Böttcher, L.
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    Bauer, J.
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    Jung, E.
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    Becker, K.-F.
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    Ostmann, A.
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    Aschenbrenner, R.
    ;
    Reichl, H.
    A technology platform based on standard PCB technology has been developed for cost-effective fabrication of biological and medical test devices. Aluminum, polyimide and Pyralux have been selected as materials with focus on bio- and process compatibility. A process flow consisting of lamination, Al structuring by wet etching, microwell and via formation by laser drilling and via metallization was developed. Surface treatments have been evaluated for hydrophobic and hydrophilic modification of the materials. The technology was demonstrated with a dielectrophoresis enhanced microwell device for single cell handling and detection of cell-to-cell interaction as needed for the improvement of tumor therapy.
  • Publication
    Smart sensor systems - packaging technologies for multi-sensory consumer applications
    ( 2009)
    Jung, E.
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    Becker, K.-F.
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    Braun, T.
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    Aschenbrenner, R.
    The advent of monolithically integrated systems 'More than Moore' leveraging nanoscale technology for sensors and RF systems as well as the growing maturity of System on Chip (SoC) solutions have increased the function per area significantly. Packaging technology now enables to use these devices in a maximum level of integration, enabling also the use of the third dimension to a paradigm shift towards function per volume.
  • Publication
    Micro to nano - scaling packaging technologies for future microsystems
    ( 2008)
    Braun, T.
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    Becker, K.-F.
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    Bauer, J.
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    Hausel, F.
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    Pahl, B.
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    Wittler, O.
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    Mrossko, R.
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    Jung, E.
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    Ostmann, A.
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    Koch, M.
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    Bader, V.
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    Minge, C.
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    Aschenbrenner, R.
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    Reichl, H.
    As the development of microelectronics is still driving towards further miniaturization new materials, processes and technologies are crucial for the realization of future cost effective microsystems and components. These future systems will not only consist of SMDs and ICs assembled on a substrate, but will potentially integrate also living cells, organelles, nanocrystals, tubules and other tiny things forming a true Heterogeneous System. Future ICs and passives will also decrease in size, e.g. for RF-ID applications forecast die sizes are smaller than 250 µm, thickness less than 50 µm and pitches way below 100 µm, passives, if not directly integrated into the system carrier, will be even smaller. New placement and joining technologies are demanded for reliable and low cost assembly of such applications, as today's packaging technologies are demanded for reliable and low cost assembly of such applications, as today's packaging technologies only allow the assembly of those small dies and components with a very high effort and for this reason with high cost. With ongoing miniaturization also the protection of the microsystems mostly realized by a polymer needs to be decreased in thickness, yet providing maximum protection. Here besides mechanical stability, humidity barrier functionality is a key factor for system reliability. Fraunhofer IZMs approaches towards packaging technologies facing the demands of future nano-based Hetero System Integration are described within this paper, compromising material and process development. Material developments focus on nano-particle enhanced polymers. One example are materials with optimized humidity barrier functionality, where various filler particle are integrated into a microelectronic grade epoxy resin and investigated regarding their barrier properties. Furthermore, the processing of nano-particle filled polymers is illustrated. Process development compromises touchless handling concepts that are promising for handling miniaturized components, not directly fabricated at the very place where they are needed. Different concepts are under evaluation. Magnetic handling can be regarded as one of the most ripened ones, thanks to the rugged approach explored. Another promising concept is the use of microdroplet manipulation by electrowetting. Results from both concepts show potential for future use. Finally advanced interconnect concepts for low temperature joining by CNT contacts or reactive interconnects are introduced. In summary an overview on nano-based technologies for heterogeneous system integration is given.
  • Publication
    Overmolded FC-SiP for miniaturized devices
    ( 2007)
    Jung, E.
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    Koch, M.
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    Becker, K.-F.
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    Bader, V.
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    Aschenbrenner, R.
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    Reichl, H.
    The degree of integration of modern circuits has gone from singledie towards multi-die or even system partition integration. System-In-Package concepts allow to integrate in a hybrid form circuit components steming from different manufacturing processes e.g. CMOS, GaAs, MEMS as well as SMD chips. Combining Flip Chip technology, advanced PCB manufacturing, advanced assembly processes and large area overmolding, highly integrated and reliable sub-systems can be created. The paper describes the individual process steps for a GSM-Power Amplifier module, integrating the PA as a flip chip with the matching SMD components into a novel QFN concept featuring a laser structured bump-on-pad interconnect technology. Large area overmolding covers and protects the entire subsystem thus created. Manufacturing issues as well as specific fabrication details are highlighted and a reliability test shows the performance of the concept under harsh environmental load.
  • Publication
    Microtechnology for realization of dielectrophoresis enhanced microwells for biomedical applications
    ( 2007)
    Braun, T.
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    Böttcher, L.
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    Bauer, J.
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    Manessis, D.
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    Jung, E.
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    Ostmann, A.
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    Becker, K.-F.
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    Aschenbrenner, R.
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    Reichl, H.
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    Guerrieri, R.
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    Gambari, R.
    Microtechnologies are widely used in many applications as e.g. for the automotive or telecommunication industry. But it could be also a versatile tool for biological and biomedical applications. Microwells have been established long in this application field but remained without any additional functionality up to now. Merging new fabrication techniques and handling concepts with microelectronics enables the realization of intelligent microwells suitable for future applications e.g. improved cancer treatment. For the implementation of a dielectrophoresis enhanced microwell device a technology based on standard PCB technology has been developed. But as materials from PCB technology are not biocompatible new materials have to be selected, tested and processes adapted to these new packaging materials. With promising preselected materials for an enhanced microwell device biocompatibility tests have been carried out. As base conducting metal layer Aluminum has been selected. Different dielectric materials were evaluated with focus on their processability. Goal of this preselection study was to find materials, which allow a fine structuring and realization of thin layers for the required application geometries. Thin aluminum foils are structured by laser micro machining and laminated successively to obtain minimum registration tolerances of the respective layers. The microwells are also laser machined into the laminate, allowing capturing and handling individual cells within a dielectrophoretic cage realized by the structured aluminum as well as providing access holes for the layer-to-layer interconnection. Furthermore, surface treatments with e.g. thiols and fluorinated acrylates on different materials were inspected by surface tension and wetting analysis to allow designing the hydrophilic/hydrophobic microfluidic networks required for the microwell device. First demonstrators are presenting the developed technologies and structures realized. In summary this paper desc
  • Publication
    New sensor packaging concept for avionic application
    ( 2007)
    Aschenbrenner, R.
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    Jung, E.
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    Braun, T.
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    Oestermann, U.
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    Bauer, J.
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    Becker, K.-F.
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    Reichl, H.
  • Publication
    Rapid tooling for high reliability transfer molded devices
    ( 2006)
    Becker, K.-F.
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    Koch, M.
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    Gramckow, J.
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    Braun, T.
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    Bader, V.
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    Jung, E.
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    Lang, K.-D.
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    Aschenbrenner, R.
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    Reichl, H.
  • Publication
    Duromer MID technology for system-in-package generation
    ( 2005)
    Becker, K.-F.
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    Braun, T.
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    Neumann, A.
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    Ostmann, A.
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    Koch, M.
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    Bader, V.
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    Aschenbrenner, R.
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    Reichl, H.
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    Jung, E.
    The Duromer MID technology for realization of stackable SIPs is similar to conventional Molded Interconnect Device (MID) technology, which is usually realized using thermoplastic polymers, combining the functionality of housing and substrate into one device. Advantages of the conventional MID technology are the reduction of parts during assembly by integrating mechanical and electrical functionality into a device and the reduction of space, as MID allows a 3D integration of devices. Disadvantage of conventional technology, especially if combined with typical technical thermoplastics is the large mismatch in coefficient of thermal expansion (CTE) between substrate and advanced microelectronic components as CSP or flip chip. This is reducing the applicability of thermoplastic MID to moderate temperature ranges and/or to rather robust components. To overcome this disadvantage the use of low CTE duromer as Epoxy Molding Compounds (EMC) as base material for device assembly is proposed, generating a unique technology well adapted to SIP and MEMS packaging needs, the Duromer MID approach. The technological realization of Duromer MID uses conventional backend processes as IC bonding to flex, transfer molding using epoxy molding compounds, laser machining, metallization and structurization processes well known from PCB processing. The use of existing equipment allows both, a rather fast process implementation and a cost effective manufacturing of the components. Within this paper the investigations described previously [1] are driven further towards a description of a generic packaging technology integrating detailed analysis of metallization processes and assembly issues. Summarized this paper presents further process development and feasibility analysis of wafer level packaging technologies for SiP solutions based on a Duromer MID approach.