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Avoiding cross talk and feed back effects in packaging coplanar millimeter-wave circuits

Unterdrückung des Übersprechens und Rückkopplungseffekte beim Einbau von koplanaren Millimeterschaltungen
: Krems, T.; Tessmann, A.; Haydl, W.H.; Schmelz, C.; Heide, P.


Meixner, R.; Cruz, J.J. ; Institute of Electrical and Electronics Engineers -IEEE-; IEEE Microwave Theory and Techniques Society:
IEEE MTT-S International Microwave Symposium Digest 1998. Vol.2
Piscataway, NJ: IEEE, 1998
ISBN: 0-7803-4471-5
pp.1091-1094 : Ill.
International Microwave Symposium <1998, Baltimore/Md.>
Conference Paper
Fraunhofer IAF ()
coplanar; Einbautechnik; koplanar; MMIC; packaging; parasitäre Moden; parasitic modes

The impact of the packaging configuration on cross talk and feed back effects caused by parasitic substrate modes is investigated for coplanar millimeter-wave circuits. It is demonstrated theoretically and by means of several circuit examples that both the mounting configuration and the thickness of the semiconductor substrate of coplanar MMICs have to be chosen appropriately, in order to avoid circuit degradation or even failure.