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  4. International IEEE MTT/AP Workshop on MMIC Design, Packaging, and System Applications 1998
 
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1998
Conference Proceeding
Title

International IEEE MTT/AP Workshop on MMIC Design, Packaging, and System Applications 1998

Corporate Author
Institute of Electrical and Electronics Engineers -IEEE-, German Section
Fraunhofer-Institut für Angewandte Festkörperphysik -IAF-, Freiburg/Brsg.
Publisher
Fraunhofer IRB Verlag  
Publishing Place
Stuttgart
Conference
International IEEE MTT/AP Workshop on MMIC Design, Packaging, and System Applications 1998  
Language
English
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Keyword(s)
  • Flip-Chip-Technologie

  • Galliumarsenid

  • HF-Komponenten

  • Kfz-Abstandswarnradar

  • Kommunikationssystem

  • MMIC

  • Schaltungsentwurf

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