2019
Book
Title

Handbook of 3D Integration. Design, Test, and Themal Management. Vol.4: Design, Test and Thermal Management of 3D Integrated Circuits

Author(s)
Franzon, Paul D.
North Carolina State University
Marinissen, Erik Jan
IMEC
Bakir, Muhannad S.
Georgia Institute of Technology
Garrou, Philip
Microelectronics Consultants of NC
Koyanagi, Mitsumasa
Tohoku University
Ramm, Peter  
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT  
Publisher
Publishing Place
Weinheim
Language
English
Keyword(s)