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Polishing of silicon based advanced ceramics

: Klocke, F.; Dambon, O.; Zunke, R.; Waechter, D.


Yang, L. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Advanced optical manufacturing technologies. 4th International Symposium on Advanced Optical Manufacturing and Testing Technologies 2008. Pt.1 : 19 - 21 November 2008, Chengdu, China
Bellingham, WA: SPIE, 2009 (Proceedings of SPIE 7282)
ISBN: 978-0-8194-7542-8
Paper 728207
International Symposium on Advanced Optical Manufacturing and Testing Technologies (AOMATT) <4, 2008, Chengdu>
Conference Paper
Fraunhofer IPT ()

Silicon based advanced ceramics show advantages in comparison to other materials due to their extreme hardness, wear and creep resistance, low density and low coefficient of thermal expansion. As a matter of course, machining requires high efforts. In order to reach demanded low roughness for optical or tribological applications a defect free surface is indispensable. In this paper, polishing of silicon nitride and silicon carbide is investigated. The objective is to elaborate scientific understanding of the process interactions. Based on this knowledge, the optimization of removal rate, surface quality and form accuracy can be realized. For this purpose, fundamental investigations of polishing silicon based ceramics are undertaken and evaluated. Former scientific publications discuss removal mechanisms and wear behavior, but the scientific insight is mainly based on investigations in grinding and lapping. The removal mechanisms in polishing are not fully understood due to complexity of interactions. The role of, e.g., process parameters, slurry and abrasives, and their influence on the output parameters is still uncertain. Extensive technological investigations demonstrate the influence of the polishing system and the machining parameters on the stability and the reproducibility. It is shown that the interactions between the advanced ceramics and the polishing systems is of great relevance. Depending on the kind of slurry and polishing agent the material removal mechanisms differ. The observed effects can be explained by dominating mechanical or chemo-mechanical removal mechanisms. Therefore, hypotheses to state adequate explanations are presented and validated by advanced metrology devices, such as SEM, AFM and TEM.