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  4. Advanced multi-wire slicing according to "both direction" machining kinematics
 
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2003
Conference Paper
Title

Advanced multi-wire slicing according to "both direction" machining kinematics

Abstract
The Multi-Wire Slicing (MWS) technique is successfully introduced in the mass production of plane workpieces such as wafers due to its high productivity. With increasing demands on the wafer's quality, especially with regard to the rising wafer diameters, the existing MWS-technique has to be improved. One promising new approach, the »Both Direction« (BD) machining principle, is proposed.
Author(s)
Klocke, Fritz
Huttenhuis, S.
Pähler, Dietmar
Vojtechovsky, K.
Mainwork
EUSPEN International Topical Conference on Precision Engineering, Micro Technology, Measurement Techniques and Equipment 2003. Proceedings. Vol.1  
Conference
International Topical Conference on Precision Engineering, Micro Technology, Measurement Techniques and Equipment 2003  
Language
English
Fraunhofer-Institut für Produktionstechnologie IPT  
Keyword(s)
  • wafer silicon

  • lapping

  • Wire

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