https://publica.fraunhofer.de/entities/orgunit/aec13a9c-1289-4ea4-98fb-b4fb2ef3903e
https://publica.fraunhofer.de/entities/publication/aec146d5-c93a-499a-bc6f-e76e3ccf43c0
https://publica.fraunhofer.de/entities/mainwork/aec171a1-cce9-4d65-bdf7-869d9ed592e6
https://publica.fraunhofer.de/entities/publication/aec1cef6-06f8-4714-8236-f8aefbee4c5c
https://publica.fraunhofer.de/entities/publication/aec1d1e1-6f63-491a-b655-4bbdee29803a
https://publica.fraunhofer.de/entities/mainwork/aec1e695-96fa-4823-b784-4ef4cb5afd6f
https://publica.fraunhofer.de/entities/journal/aec20691-8f71-473e-961d-3207d795f502
https://publica.fraunhofer.de/entities/publication/aec210e2-a6cd-44f0-81ec-215f49fe266f
https://publica.fraunhofer.de/entities/mainwork/aec21a7a-9b95-47a7-8376-b9f9df6a6b96
https://publica.fraunhofer.de/entities/mainwork/aec2dfaa-7112-4ff8-869e-08070ac9e4a9
https://publica.fraunhofer.de/entities/project/aec2e523-68fa-45e9-aeba-5111212c50d6
https://publica.fraunhofer.de/entities/publication/aec322a9-e088-4b5f-8d1d-7fd44d67a97e
https://publica.fraunhofer.de/entities/publication/aec41719-5455-4f38-8ac5-d6acadb2c49f
https://publica.fraunhofer.de/entities/publication/aec41838-3cec-4727-bc24-a03e1b584c04
https://publica.fraunhofer.de/entities/publication/aec425f1-630f-4641-8f36-bb39a0ef11db
https://publica.fraunhofer.de/entities/publication/aec42951-4c5a-4f1f-a8bd-3e65419d5a6f
https://publica.fraunhofer.de/entities/publication/aec44e85-9c87-454a-a20d-44e7d7306dc8
https://publica.fraunhofer.de/entities/publication/aec468e1-1e5e-46c5-848c-f4f795bd5327
https://publica.fraunhofer.de/entities/person/aec47a28-d0b5-43fc-965e-4cf4b40918ba
https://publica.fraunhofer.de/entities/mainwork/aec480e6-c2b2-4e83-8cc4-ef14fc28afb2
https://publica.fraunhofer.de/entities/mainwork/aec4995a-a616-40b7-a9fd-073cad7d004b
https://publica.fraunhofer.de/entities/publication/aec4ddcd-4f92-43da-8333-f624cdce7773
https://publica.fraunhofer.de/entities/publication/aec4e68e-176a-4c7d-a834-03b5d6974303
https://publica.fraunhofer.de/entities/publication/aec5142c-c036-4836-a7c7-a26b997ab117
https://publica.fraunhofer.de/entities/publication/aec528c2-6aa3-44bb-bba0-96a957d95da2
https://publica.fraunhofer.de/entities/publication/aec53776-e0ba-4c9f-b536-9a56ee57ae07
https://publica.fraunhofer.de/entities/publication/aec54cb3-2ac8-41a1-9541-9f7964de7f69
https://publica.fraunhofer.de/entities/event/aec55206-90a3-4d7a-ad2b-50de51b96482
https://publica.fraunhofer.de/entities/publication/aec55228-5b20-45e6-a7f8-0f0ec28fe574
https://publica.fraunhofer.de/entities/publication/aec56f4c-49f4-4e9d-8997-391062e3429a
https://publica.fraunhofer.de/entities/publication/aec5a606-1eaf-43f0-9695-46c9620d40de
https://publica.fraunhofer.de/entities/publication/aec5ab35-0bd9-4bbc-853f-778214bc2786
https://publica.fraunhofer.de/entities/event/aec5b501-f00e-477f-90b7-8749f40d449a
https://publica.fraunhofer.de/entities/publication/aec5f345-db71-4857-bb3b-3fd7d42f5000
https://publica.fraunhofer.de/entities/patent/aec60cdd-0af3-4216-8696-dc194b0f90f2
https://publica.fraunhofer.de/entities/orgunit/aec60d35-c265-4de8-aee8-46c4c5dec004
https://publica.fraunhofer.de/entities/project/aec68031-722d-4406-9585-db230409bae4
https://publica.fraunhofer.de/entities/orgunit/aec6ea1e-eaf5-4612-ae88-ad7a2cf62c8c
https://publica.fraunhofer.de/entities/publication/aec6fa2f-0964-436e-b5bc-80d825766c20
https://publica.fraunhofer.de/entities/publication/aec71f7b-4fdb-4031-8879-0a246f6172a1
https://publica.fraunhofer.de/entities/mainwork/aec75d07-0c06-4310-9c89-b99168657662
https://publica.fraunhofer.de/entities/mainwork/aec78a3f-15a8-497e-a038-350b5851b358
https://publica.fraunhofer.de/entities/event/aec78a74-cc10-4e0c-8001-029df249f193
https://publica.fraunhofer.de/entities/publication/aec79223-de9b-41ca-b707-dafa8df25e6b
https://publica.fraunhofer.de/entities/orgunit/aec7ae36-bbaa-4ed8-a06c-b5ad86b4b85c
https://publica.fraunhofer.de/entities/publication/aec7b145-1e46-4338-9701-9430e9c64e5b
https://publica.fraunhofer.de/entities/journal/aec7e6db-7a87-411e-b1db-b9688543a5d2
https://publica.fraunhofer.de/entities/publication/aec81571-aca4-42cf-bbb1-aca18293c880
https://publica.fraunhofer.de/entities/event/aec86eca-07cc-4a97-b8fc-694fe9c968e8
https://publica.fraunhofer.de/entities/orgunit/aec8bb11-b2a1-4a6a-84b8-2ca28f043741
https://publica.fraunhofer.de/entities/event/aec8daaf-0d03-4976-9b04-84b515811592
https://publica.fraunhofer.de/entities/funding/aec8ebd1-e117-42a9-b80a-a2fe09dc8a81
https://publica.fraunhofer.de/entities/publication/aec8ef0c-20fa-40b0-8841-987c9fdfce2a
https://publica.fraunhofer.de/entities/publication/aec98d63-4f12-4581-8a65-a8b599c38730
https://publica.fraunhofer.de/entities/publication/aec9cd07-ae6a-4248-b0a7-b8f7758c79a7
https://publica.fraunhofer.de/entities/publication/aec9e311-de0c-4927-a8e9-581a07f9cf4e
https://publica.fraunhofer.de/entities/project/aec9f91c-8833-48cd-b04d-105cf6a5ba6e
https://publica.fraunhofer.de/entities/publication/aeca1770-7185-4955-9ee2-f8032ebd62e7
https://publica.fraunhofer.de/entities/publication/aeca2d2d-0162-4408-a396-662f0eb87882
https://publica.fraunhofer.de/entities/publication/aeca39d2-dca7-4b74-8ad7-69f179877622
https://publica.fraunhofer.de/entities/event/aecab0de-73f4-46eb-aae9-ef0ac5f48075
https://publica.fraunhofer.de/entities/publication/aecabc2f-d4d0-45f9-864d-d654c10b0f1e
https://publica.fraunhofer.de/entities/orgunit/aecac077-2350-4f07-92a8-c65f393da448
https://publica.fraunhofer.de/entities/publication/aecaf64c-48ee-42a6-9f42-fb8514a438be
https://publica.fraunhofer.de/entities/publication/aecb235e-98df-4ac2-8b0f-06ae3f9acc76
https://publica.fraunhofer.de/entities/publication/aecb26cc-a189-4b1f-980a-18f95f144797
https://publica.fraunhofer.de/entities/publication/aecb44b3-9f80-41df-bd8f-92a66b334337
https://publica.fraunhofer.de/entities/publication/aecb60d9-2967-48c6-8bd9-e20797b31be0
https://publica.fraunhofer.de/entities/publication/aecb6bbc-9bab-4e50-be94-92279db69960
https://publica.fraunhofer.de/entities/publication/aecb8820-381b-4478-a114-51364cc27c30
https://publica.fraunhofer.de/entities/orgunit/aecbc66f-f617-4a91-ac5f-d3f7a7ee0dd5
https://publica.fraunhofer.de/entities/journal/aecbf356-586f-4740-99fd-891dca92d6e8
https://publica.fraunhofer.de/entities/publication/aecc022d-988f-441c-b3a2-6209cdabd58e
https://publica.fraunhofer.de/entities/orgunit/aecc10c6-7c33-4f18-a5b7-450707963e8a
https://publica.fraunhofer.de/entities/publication/aecc3f81-359e-4665-a7bc-d26053f6b3fe
https://publica.fraunhofer.de/entities/orgunit/aecc4e85-3bc3-4d54-9cc7-a51e99c6d5e6
https://publica.fraunhofer.de/entities/publication/aecc7c14-d885-4a7e-9779-f105752b9f4b
https://publica.fraunhofer.de/entities/publication/aecc910b-438c-434b-97d1-2c0d09fa1cf3
https://publica.fraunhofer.de/entities/person/aeccb235-d322-4ae8-8be4-bf8589df5bcc
https://publica.fraunhofer.de/entities/publication/aeccbb11-068d-4528-8ebd-ac90b8ba9bde
https://publica.fraunhofer.de/entities/mainwork/aecd2ef8-603d-4b46-98b2-7c7b57ea21ea
https://publica.fraunhofer.de/entities/publication/aecd372a-8204-4d7c-9130-97c5b1d7e8dd
https://publica.fraunhofer.de/entities/publication/aecd6675-0e5b-4352-97e1-40f83ed8e950
https://publica.fraunhofer.de/entities/publication/aecd813c-51fc-406e-84b9-392cad4cafd9
https://publica.fraunhofer.de/entities/event/aecd97ce-4bc5-4cb6-9c9a-bd05723490d0
https://publica.fraunhofer.de/entities/publication/aecd9bf8-1540-41c5-8c74-0d5bf63f7151
https://publica.fraunhofer.de/entities/mainwork/aecdabf4-b005-4e75-bfff-a518c1047834
https://publica.fraunhofer.de/entities/mainwork/aece1b42-3c4d-4fce-bd3c-746994f625dd
https://publica.fraunhofer.de/entities/publication/aece5aae-c1b9-4dc9-a59b-e2f307f9e03a
https://publica.fraunhofer.de/entities/mainwork/aece6083-5660-41dc-b9a3-337843b9615d
https://publica.fraunhofer.de/entities/mainwork/aece76e6-b776-4711-a177-4d097719f311
https://publica.fraunhofer.de/entities/publication/aece7dea-5081-4720-ad36-cdb6497ac949
https://publica.fraunhofer.de/entities/event/aece936a-50bb-40a7-aa20-3d1cd628ab4d
https://publica.fraunhofer.de/entities/event/aece9ae5-c5e0-4339-80a7-5e5f712960aa
https://publica.fraunhofer.de/entities/mainwork/aeceb642-298b-497c-bd5d-832f263a9185
https://publica.fraunhofer.de/entities/publication/aecebc10-6622-43dc-9793-92910964a332
https://publica.fraunhofer.de/entities/event/aecee396-20f0-449c-afc7-bf72917db6e8
https://publica.fraunhofer.de/entities/patent/aecee3ee-33ce-44c4-83f0-5d3e9800f7ef
https://publica.fraunhofer.de/entities/mainwork/aecf0b26-a78b-44f7-a9a5-a3a4080517b2
https://publica.fraunhofer.de/entities/publication/aecf0f42-61dd-4181-b111-fca1ea8e11f7
https://publica.fraunhofer.de/entities/project/aecf4e6c-2bdb-4ad3-82a6-5617fbbf2930
https://publica.fraunhofer.de/entities/publication/aecf61dd-136b-4848-9c74-0723c42ad83d
https://publica.fraunhofer.de/entities/publication/aecf7697-7dc3-4f81-81db-f105072e5e49
https://publica.fraunhofer.de/entities/event/aecfe556-8fe6-40d1-b4b6-0c8efa2661cc
https://publica.fraunhofer.de/entities/publication/aecff641-001c-4677-b0fd-a43cd9eb9645
https://publica.fraunhofer.de/entities/journal/aed031cf-77a1-4ca3-bfba-e8752b01fe5f
https://publica.fraunhofer.de/entities/event/aed0347e-8ceb-4d37-af23-1856d70eff50
https://publica.fraunhofer.de/entities/publication/aed0659d-ca75-495a-9ca8-80212ab2e3ed
https://publica.fraunhofer.de/entities/publication/aed067a8-d25b-4122-af09-58ec58e58b32
https://publica.fraunhofer.de/entities/publication/aed0814e-a5fa-42f3-864e-55d7487e64d7
https://publica.fraunhofer.de/entities/mainwork/aed08851-ea4f-4071-b629-0561a6814b57
https://publica.fraunhofer.de/entities/publication/aed0a7f3-2a17-43ab-8e76-13da1e5bba45
https://publica.fraunhofer.de/entities/publication/aed0d506-5d67-43f9-9faa-d05f688afdd0
https://publica.fraunhofer.de/entities/mainwork/aed12e1d-19c8-426e-8040-3da3ed09ae49
https://publica.fraunhofer.de/entities/mainwork/aed13e63-a1da-4ec5-bb70-bb9b558e99a8
https://publica.fraunhofer.de/entities/publication/aed18604-e868-4843-837c-6e8937dfac37
https://publica.fraunhofer.de/entities/publication/aed1ab8c-d14e-4be8-a3a7-a1f97b5cce20
https://publica.fraunhofer.de/entities/publication/aed1ab8d-53f6-4244-9ec2-aeab11d8ad5c
https://publica.fraunhofer.de/entities/publication/aed1b513-be7f-4335-8b4a-aeefc8b65357
https://publica.fraunhofer.de/entities/publication/aed20443-9259-4eb7-85da-f92ebbb5891a
https://publica.fraunhofer.de/entities/journal/aed22981-78eb-4a1d-98bc-225cd81faa88
https://publica.fraunhofer.de/entities/orgunit/aed29730-84f0-4d08-9d1f-a79232b6c462
https://publica.fraunhofer.de/entities/publication/aed29ac3-61a5-402b-b61b-0650a767c4cc
https://publica.fraunhofer.de/entities/orgunit/aed2a86f-5c20-4fc8-af32-3110c4b672ff
https://publica.fraunhofer.de/entities/publication/aed2c6d7-7efa-484c-92f5-c7207e6b1850
https://publica.fraunhofer.de/entities/journal/aed2f584-c577-4b03-9b69-6344d36dafca
https://publica.fraunhofer.de/entities/event/aed2f738-2c25-4e31-8623-bab00a0a3db7
https://publica.fraunhofer.de/entities/publication/aed311a7-ef28-4639-81c9-fedf6eedd5e4
https://publica.fraunhofer.de/entities/mainwork/aed3146a-9c95-4684-bc2b-98d7fa323e9c
https://publica.fraunhofer.de/entities/publication/aed31a53-2567-4a2d-889a-11bd63cbaec0
https://publica.fraunhofer.de/entities/journal/aed32761-87f6-4044-b208-393c539962e4
https://publica.fraunhofer.de/entities/publication/aed35f1e-5509-4360-bd24-fc6bbf8b6916
https://publica.fraunhofer.de/entities/publication/aed36771-5134-440e-a96e-5077b276f641
https://publica.fraunhofer.de/entities/publication/aed3a439-0ecf-4190-8a19-2fba66d1c00b
https://publica.fraunhofer.de/entities/mainwork/aed3d3b0-cb45-4ab2-9707-3627477c4674
https://publica.fraunhofer.de/entities/publication/aed3e065-8483-4afc-bc33-cb4406127224
https://publica.fraunhofer.de/entities/publication/aed3ffd7-2a67-4fae-8d4d-f5ecc0c59b3e
https://publica.fraunhofer.de/entities/publication/aed423f9-2fa1-4f1c-a14d-1d5b2764ff4c
https://publica.fraunhofer.de/entities/event/aed4877a-815b-4ca3-a433-2a738a7827f2
https://publica.fraunhofer.de/entities/event/aed4d2e0-1ad7-42ba-b921-35eeec171a76
https://publica.fraunhofer.de/entities/funding/aed4e68e-b8c5-45e8-9b50-2223f7983625
https://publica.fraunhofer.de/entities/publication/aed53061-b6d7-48d4-9cb5-d105b0b575dd
https://publica.fraunhofer.de/entities/publication/aed540f6-37f7-4fb1-8e5f-d292c7d35dcf
https://publica.fraunhofer.de/entities/publication/aed54821-5b41-4d03-852e-0f0bdda922eb
https://publica.fraunhofer.de/entities/publication/aed54f9e-786a-43bb-a8d1-160e8c04ee53
https://publica.fraunhofer.de/entities/publication/aed57800-abff-41b6-b120-3cdf9ba1c3cc
https://publica.fraunhofer.de/entities/publication/aed58f3f-aa56-45b2-8378-5b005a3379c8
https://publica.fraunhofer.de/entities/publication/aed59cbe-d4de-4abb-b731-f8e392c08fd2
https://publica.fraunhofer.de/entities/publication/aed5c34c-662d-428c-8494-bf90dd6b0a62
https://publica.fraunhofer.de/entities/publication/aed6198a-9b60-45ca-90a2-c06004dcf8de
https://publica.fraunhofer.de/entities/event/aed65e68-55f3-4a7b-aec1-bfd4b265dcb7
https://publica.fraunhofer.de/entities/publication/aed6bef9-2830-443c-b84e-f76b3db8a614
https://publica.fraunhofer.de/entities/publication/aed72977-ae4d-4e90-aa77-366394b5b2c1
https://publica.fraunhofer.de/entities/publication/aed7403e-4282-4cfc-a02d-339e88605d1a
https://publica.fraunhofer.de/entities/publication/aed740d3-ca07-49df-906d-259cdfa4692d
https://publica.fraunhofer.de/entities/orgunit/aed75352-579b-4094-8c29-8a029803ee0c
https://publica.fraunhofer.de/entities/mainwork/aed75662-af9e-4ce2-9f37-a8f8dc366374
https://publica.fraunhofer.de/entities/mainwork/aed78ccd-a08b-45c6-a205-4ee181f77435
https://publica.fraunhofer.de/entities/patent/aed7b812-aa86-4d79-b037-859958a04045
https://publica.fraunhofer.de/entities/publication/aed7b866-bfa0-4708-baa6-45d07d161cc8
https://publica.fraunhofer.de/entities/publication/aed7de20-681b-42c4-9a8a-ae5f529cc322
https://publica.fraunhofer.de/entities/publication/aed7eac6-b152-4bb4-b4a4-e41e2297505c
https://publica.fraunhofer.de/entities/publication/aed80f37-49bb-41a6-9067-1968264f87cc
https://publica.fraunhofer.de/entities/project/aed8556a-f554-47cc-810a-af9297283e7d
https://publica.fraunhofer.de/entities/publication/aed878d9-3603-442f-8bb4-9d2531a23227
https://publica.fraunhofer.de/entities/patent/aed898a3-340f-4dce-b815-bf3fbdf8000b
https://publica.fraunhofer.de/entities/orgunit/aed8a313-4f0d-485d-9a9f-6fca339daa45
https://publica.fraunhofer.de/entities/event/aed8cc27-8f4d-469a-aef6-3fb30f55f7d3
https://publica.fraunhofer.de/entities/publication/aed90003-ae8a-473d-b04a-e9f8d53347a6
https://publica.fraunhofer.de/entities/publication/aed9112e-1c98-43e4-93cf-580b217116cf
https://publica.fraunhofer.de/entities/event/aed91bde-40f1-4837-8dcd-d7fad948ef69
https://publica.fraunhofer.de/entities/event/aed91f12-1f86-46ab-9dd6-4cb4fe519959
https://publica.fraunhofer.de/entities/mainwork/aed926f7-72e8-47b1-b552-f18880f817ea
https://publica.fraunhofer.de/entities/publication/aed92d2f-b176-4851-8320-9e7c26e9e6f6
https://publica.fraunhofer.de/entities/patent/aed93596-40ec-4382-91f5-0a5fb9023456
https://publica.fraunhofer.de/entities/publication/aed9373b-309d-4f55-ac87-1d0d41c4aa35
https://publica.fraunhofer.de/entities/event/aed97fc7-e52c-475f-9a0f-117a213b6d82
https://publica.fraunhofer.de/entities/publication/aed98839-9a5c-47d8-be15-c956c6697b64
https://publica.fraunhofer.de/entities/person/aed9c257-b003-4d32-9cfd-92bcf2162337
https://publica.fraunhofer.de/entities/event/aed9e8da-0d1f-4bb0-8ff4-76896f840926
https://publica.fraunhofer.de/entities/event/aed9f62e-c04d-49e4-a5f6-80591bb83f5d
https://publica.fraunhofer.de/entities/publication/aeda0cf5-537d-40e1-8dd3-1071dd744e07
https://publica.fraunhofer.de/entities/publication/aeda1992-3632-4a6f-bb8d-5ffb5834743c
https://publica.fraunhofer.de/entities/project/aeda2620-b144-4e41-b4eb-40fe01741618
https://publica.fraunhofer.de/entities/orgunit/aedabb83-ed38-4e0c-925b-6e88ba93d978
https://publica.fraunhofer.de/entities/journal/aedabbb4-c08c-4ab0-9876-b498d5659f66
https://publica.fraunhofer.de/entities/publication/aedaef4d-81ab-4dc5-a296-15d7e618260f
https://publica.fraunhofer.de/entities/orgunit/aedb2d69-6271-4ba8-b077-63744ab1b296
https://publica.fraunhofer.de/entities/publication/aedb3241-595a-4755-9653-4bd9c19a9a4a
https://publica.fraunhofer.de/entities/publication/aedb4939-be4c-43fd-be24-bd6948397efc
https://publica.fraunhofer.de/entities/event/aedb72eb-2d96-4d0d-85ea-f843d0052aa9
https://publica.fraunhofer.de/entities/publication/aedb812a-1c9e-4067-9d94-e1c33fcb1f8d
https://publica.fraunhofer.de/entities/mainwork/aedb9b65-4775-4615-828f-3f6d93442ea1
https://publica.fraunhofer.de/entities/publication/aedba65d-6184-4168-ae28-9b986258ccee
https://publica.fraunhofer.de/entities/publication/aedbabb6-8c7e-407d-af3a-ccf3092eef0e
https://publica.fraunhofer.de/entities/publication/aedbfc61-0b50-4723-82cc-ad40d23edd4c
https://publica.fraunhofer.de/entities/mainwork/aedbff27-6ce5-4401-8709-00dc137d873d
https://publica.fraunhofer.de/entities/event/aedc13be-1ae6-44c9-8a84-add2558842d1
https://publica.fraunhofer.de/entities/publication/aedc2029-9bf5-4f9b-88ac-6f60532e97aa
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https://publica.fraunhofer.de/entities/publication/aedcb9e5-6cc8-4653-935e-fd190585e879
https://publica.fraunhofer.de/entities/publication/aedcd0e0-a251-41ea-96ae-4ec95ddc74b4
https://publica.fraunhofer.de/entities/mainwork/aedcd52a-299a-4ba3-a204-810464868f0a
https://publica.fraunhofer.de/entities/publication/aedcdbff-27e4-45e7-b316-b5c3901808b7
https://publica.fraunhofer.de/entities/publication/aedcfd81-ec69-48a3-b35d-c8214471951e
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https://publica.fraunhofer.de/entities/mainwork/aedd51f5-8608-466d-9e33-9b25ecbbb248
https://publica.fraunhofer.de/entities/event/aedd82a6-11aa-43cd-905e-aa021cd9a8b1
https://publica.fraunhofer.de/entities/publication/aedda185-6f3f-4891-9c37-2cf3989c836a
https://publica.fraunhofer.de/entities/publication/aede040f-81b4-43fb-91cc-b07c2a438183
https://publica.fraunhofer.de/entities/publication/aede1dce-4156-4c9d-9ebb-d00d80a9b1c2
https://publica.fraunhofer.de/entities/publication/aede39a5-2cee-428b-a862-dad77fea679a
https://publica.fraunhofer.de/entities/publication/aede5048-27a3-45af-ae21-c0d8fbecb8ce
https://publica.fraunhofer.de/entities/publication/aede5275-8fa5-4d92-b796-3a14fe1228fd
https://publica.fraunhofer.de/entities/publication/aedea1c2-57e4-4fd0-a1b4-0595577b890a
https://publica.fraunhofer.de/entities/publication/aedef3eb-fc0c-450c-bbb2-6795f2e6bc77
https://publica.fraunhofer.de/entities/publication/aedefa37-6551-47c9-8197-3239f84f6587
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https://publica.fraunhofer.de/entities/event/aedf9903-b649-498b-ad56-e866195bbbad
https://publica.fraunhofer.de/entities/publication/aedfb64b-6e2c-436d-bdf9-d9d641525263
https://publica.fraunhofer.de/entities/orgunit/aedfbfc1-bbfc-4a85-a84b-e2207d60db1c
https://publica.fraunhofer.de/entities/publication/aedfefdf-f5a2-4d8f-af45-e996d61f85f1
https://publica.fraunhofer.de/entities/publication/aee0002c-4d20-4a80-993d-21fb890e76cd
https://publica.fraunhofer.de/entities/publication/aee01330-f8bf-4e0f-8384-d6aa01a324e0
https://publica.fraunhofer.de/entities/mainwork/aee028ea-502c-4e2f-8025-12b5ac38e951
https://publica.fraunhofer.de/entities/publication/aee03651-908f-4f0c-8279-572dae8504f1
https://publica.fraunhofer.de/entities/event/aee04606-c37f-4034-b4a5-91b042bcc82b
https://publica.fraunhofer.de/entities/publication/aee05293-2ef8-4f99-a039-7afe4cfacf43
https://publica.fraunhofer.de/entities/patent/aee09b37-3727-4c36-8a42-900858587892
https://publica.fraunhofer.de/entities/publication/aee0b24c-7221-48e2-8b54-f80d5f2fde3c
https://publica.fraunhofer.de/entities/publication/aee0c09c-f904-40fc-a2d9-44e9e4c2645f
https://publica.fraunhofer.de/entities/publication/aee0ecc3-decf-48fb-b532-d828c85428b0
https://publica.fraunhofer.de/entities/publication/aee0fb4c-b651-4077-aa09-7c231144c384
https://publica.fraunhofer.de/entities/event/aee12c28-e261-4521-9bb3-6ae0ff7f1307
https://publica.fraunhofer.de/entities/publication/aee13214-861f-4692-8507-ac3c03387979
https://publica.fraunhofer.de/entities/publication/aee13c4c-3765-4101-a7bf-daced6546f0e
https://publica.fraunhofer.de/entities/mainwork/aee14bfa-c39d-4297-9adf-500057a86599
https://publica.fraunhofer.de/entities/event/aee1626c-3954-46c4-b14e-820d0fd1c6ab
https://publica.fraunhofer.de/entities/mainwork/aee16f8b-a32b-4acc-989a-ca03452d7dcf
https://publica.fraunhofer.de/entities/publication/aee17362-b527-4c19-a310-cb89c65263a6
https://publica.fraunhofer.de/entities/person/aee1c608-593a-46a0-bed3-32c3dc6dcb59
https://publica.fraunhofer.de/entities/event/aee1c7c5-6052-4628-ad48-60028ecd92ba
https://publica.fraunhofer.de/entities/publication/aee1cf9a-5418-40cc-b00a-c9ec13d2ff83
https://publica.fraunhofer.de/entities/publication/aee216bc-8c99-4a34-b966-b34104658642
https://publica.fraunhofer.de/entities/patent/aee25514-a2ab-4153-a4f0-0880e4b72290
https://publica.fraunhofer.de/entities/publication/aee260df-298d-4658-8032-ff036bd3b501
https://publica.fraunhofer.de/entities/publication/aee26b1a-8313-4114-aa79-ee95db4f457a
https://publica.fraunhofer.de/entities/journal/aee27305-7d47-4c5e-adc3-f5c561e3e8e7
https://publica.fraunhofer.de/entities/publication/aee2ac9e-168f-458e-9c6f-9c5b07837c45
https://publica.fraunhofer.de/entities/event/aee2be16-9c3d-4f9e-bf88-6ab697ab75cd
https://publica.fraunhofer.de/entities/publication/aee34258-aa86-4b5c-aa21-ef5c27f265d9
https://publica.fraunhofer.de/entities/publication/aee3928c-f93f-41cd-a37a-1ef56af8358c
https://publica.fraunhofer.de/entities/publication/aee3c9b5-394e-4324-bc6e-1fbf4253ad3a
https://publica.fraunhofer.de/entities/publication/aee3e94a-5ec3-473f-a34b-ec55c8893351
https://publica.fraunhofer.de/entities/publication/aee41265-dc44-4d4f-88cc-ae7f6d38570e
https://publica.fraunhofer.de/entities/publication/aee42003-d22f-4e78-872f-a9e8628fb6b5
https://publica.fraunhofer.de/entities/mainwork/aee42302-bb24-458b-b3f9-d4439584308f
https://publica.fraunhofer.de/entities/publication/aee43689-5475-42c0-9b52-811d35fc58e5