Title

IEEE 18th Electronics Packaging Technology Conference, EPTC 2016. Proceedings

Title Supplement

30. November - 3 December 2016, Singapore

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

IEEE Components, Packaging, and Manufacturing Technology Society

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2016

ISBN

978-1-5090-4368-2

978-1-5090-4369-9

978-1-5090-4370-5

Conference