Title

2009 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP

Title Supplement

Rome, Italy, 1 - 3 April 2009. Technical presentations of 2 conferences - CAD, design and test, Microfabrication, integration and packaging

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2009

ISBN

978-1-424-43874-7

Conference