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Title
4th International Symposium on Advanced Packaging Materials - Processes, Properties and Interfaces 1998. Proceedings
Person Involved
Corporate Author
International Microelectronics and Packaging Society -IMAPS-
IEEE Components, Packaging, and Manufacturing Technology Society
Publisher
Publishing Place
Reston, Va.
Publication Date
1998
ISBN
0-7803-4795-1
0-7803-4796-X