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ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2021
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Title
ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2021
Titel Supplements
October 26-28, 2021 Virtual, Online
Institut
American Society of Mechanical Engineers -ASME-, Electronic and Photonic Packaging Division
Verlag
ASME
Verlagsort
New York/NY.
Datum
2021
Konferenz
International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (INTERPACK) 2021