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Title

Semiconductor wafer bonding 9: Science, technology, and applications

Title Supplement
Ninth International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications, held in Cancun, Mexico, as part of the 2006 fall meeting of the Electrochemical Society
Person Involved
Corporate Author
Electrochemical Society -ECS-
Electrochemical Society -ECS-, Electronics and Photonics Division
Publisher
ECS  
Publishing Place
Pennington, NJ
Publication Date
2006
Series
ECS transactions; 3, 6
ISSN
1938-5862
ISBN
1-566-77506-X
Conference
International Symposium on Semiconductor Wafer Bonding - Science, Technology, and Applications 2006  
Electrochemical Society (ECS Fall Meeting) 2006  
DDC
660
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