Title

23rd European Microelectronics and Packaging Conference & Exhibition, EMPC 2021

Title Supplement

13-16 September 2021, Online

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

International Microelectronics and Packaging Society -IMAPS-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2021

ISBN

978-1-6654-2368-7

978-0-9568086-7-7

Conference