Title

10th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009

Title Supplement

Delft, Netherlands, 26 - 29 April 2009

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

New York, NY

Publication Date

2009

ISBN

978-1-4244-4160-0

978-1-4244-4159-4

Conference