Title

21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020

Title Supplement

5-8 July 2020, Cracow, Poland, Virtual Event

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2020

ISBN

978-1-7281-6049-8

978-1-7281-6050-4

Conference