Title

International Conference on Electronics Packaging, ICEP 2022

Title Supplement
May 11-May 14, 2022, Sapporo
Corporate Author
Institute of Electrical and Electronics Engineers -IEEE-  
Japan Institute of Electronics Packaging -JIEP-  
IEEE Electronics Packaging Society  
International Microelectronics Assembly and Packaging Society -IMAPS-  
Publisher
Publication Date
2022
ISBN
978-1-6654-8469-5
978-4-9911911-3-8
DOI
Conference
Acronym
ICEP
Language
English