Title

Microelectronics and microsystems packaging

Title Supplement

April 16 - 20, 2001, San Francisco, California, USA; Published proceedings articles from Symposium N from the 2001 MRS Spring Meeting

Corporate Author

Materials Research Society -MRS-

Publisher

Publishing Place

Warrendale, Pa.

Publication Date

2001

Series

Materials Research Society Symposium Proceedings; 682

ISSN

0272-9172

ISBN

1-558-99618-4

978-1-558-99618-2

Conference