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13th International Workshop on Thermal Investigation of ICs and Systems, 2007, THERMINIC 2007. Electronic Resource
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Title
13th International Workshop on Thermal Investigation of ICs and Systems, 2007, THERMINIC 2007. Electronic Resource
Titel Supplements
17 - 19 Sept. 2007, Budapest
Institut
Circuits Multi-Projets -CMP-, Grenoble
Institute of Electrical and Electronics Engineers -IEEE-
Components, Packaging and Manufacturing Technology Society -CPMT-
Verlag
IEEE
Verlagsort
Piscataway, NJ
Datum
2007
Konferenz
International Workshop on Thermal Investigation of ICs and Systems 2007