Title

13th International Workshop on Thermal Investigation of ICs and Systems, 2007, THERMINIC 2007. Electronic Resource

Title Supplement

17 - 19 Sept. 2007, Budapest

Corporate Author

Circuits Multi-Projets -CMP-, Grenoble

Institute of Electrical and Electronics Engineers -IEEE-

Components, Packaging and Manufacturing Technology Society -CPMT-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2007

ISBN

978-2-35500-002-7

Conference