Title

15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016. Proceedings

Title Supplement

May 31 - June 03, 2016, Las Vegas, Nevada, USA

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

IEEE Components, Packaging, and Manufacturing Technology Society

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2016

ISBN

978-1-4799-5266-3

978-1-4673-8121-5

978-1-4673-8120-8

978-1-4673-8122-2

Conference