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25th International Workshop Thermal Investigations of ICs and Systems, THERMINIC 2019
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Title
25th International Workshop Thermal Investigations of ICs and Systems, THERMINIC 2019
Titel Supplements
25-27 September 2019, Politecnico di Milano, Lecco, Italy
Institut
Institute of Electrical and Electronics Engineers -IEEE-
Verlag
IEEE
Verlagsort
Piscataway, NJ
Datum
2019
Konferenz
International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) 2019