Title

International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2018. Proceedings

Title Supplement

24-26 September 2018, Austin, Texas, USA

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

IEEE Electron Devices Society

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2018

ISBN

978-1-5386-6790-3

Conference