English
Deutsch
Log In
Password Login
or
Log in with Fraunhofer Smartcard
Research Outputs
Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Hauptwerk
18th International Conference on Electronic Packaging Technology, ICEPT 2018
Information
Publications
Export
Statistics
Options
Title
18th International Conference on Electronic Packaging Technology, ICEPT 2018
Titel Supplements
Harbin, China, August 16-19, 2017
Institut
Institute of Electrical and Electronics Engineers -IEEE-
IEEE Components, Packaging, and Manufacturing Technology Society
Verlag
IEEE
Verlagsort
Piscataway, NJ
Datum
2017
Konferenz
International Conference on Electronic Packaging Technology (ICEPT) 2017