Title

IEEE 63rd Electronic Components and Technology Conference, ECTC 2013. Proceedings

Title Supplement

28-31 May 2013, Las Vegas, NV, USA

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

IEEE Components, Packaging, and Manufacturing Technology Society

Publisher

Publishing Place

New York, NY

Publication Date

2013

ISBN

978-1-4799-0233-0

978-1-4799-0232-3

Conference