Title

Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017. Collection of papers

Title Supplement

Bordeaux, France, May 29th-June 1st, 2017

Person Involved

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2017

ISBN

978-1-5386-2952-9

978-1-5386-2953-6

Conference