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Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2011
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Title
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2011
Title Supplement
11-13 May 2011, Aix-en-Provence, France
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Person Involved
Publisher
CMP
Publishing Place
Grenoble
Publication Date
2011
ISBN
978-2-35500-013-3
Conference
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) 2011