• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Hauptwerk
  4. Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2011
 
  • Details
  • Publications
Options
Title

Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2011

Title Supplement
11-13 May 2011, Aix-en-Provence, France
Person Involved
Publisher
CMP  
Publishing Place
Grenoble
Publication Date
2011
ISBN
978-2-35500-013-3
Conference
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) 2011  
  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024