Title

27th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2021

Title Supplement

September 23, 2021, Online

Person Involved

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2021

ISBN

978-1-6654-1897-3

978-1-6654-1896-6

Conference