Title

Collection of papers presented at the 14th International Workshop on Thermal Investigation of ICs and Systems 2008
Titel Supplements
Rome, Italy, 24 - 26 September 2008
Institut
Circuits Multi-Projets -CMP-, Grenoble
IEEE Components, Packaging, and Manufacturing Technology Society
Verlag
Verlagsort
Piscataway, NJ
Datum
2008
ISBN
978-1-4244-3365-0
Konferenz