Title

11th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2015

Title Supplement

Held 20 - 23 April 2015, Dresden, Germany

Corporate Author

International Microelectronics and Packaging Society -IMAPS-

American Ceramic Society -ACerS-, Westerville/Ohio

Publisher

Publishing Place

Red Hook, NY

Publication Date

2015

ISBN

978-1-5108-0456-2

Conference