Title

ESTC 2014, Electronics System Integration Technology Conference
Titel Supplements
Helsinki, Finland; 16.09. - 18.09.2014
Institut
Institute of Electrical and Electronics Engineers -IEEE-
IEEE Components, Packaging, and Manufacturing Technology Society
Verlag
Verlagsort
Piscataway, NJ
Datum
2014
ISBN
978-1-4799-4026-4
978-1-4799-4027-1
978-1-4799-4025-7
Konferenz