Title

ESTC 2014, Electronics System Integration Technology Conference

Title Supplement

Helsinki, Finland; 16.09. - 18.09.2014

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

IEEE Components, Packaging, and Manufacturing Technology Society

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2014

ISBN

978-1-4799-4026-4

978-1-4799-4027-1

978-1-4799-4025-7

Conference