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Title

Application of fracture mechanics in electronic packaging

Person Involved
Corporate Author
American Society of Mechanical Engineers -ASME-, Applied Mechanics Division
Publisher
ASME  
Publishing Place
New York, NY
Publication Date
1997
Series
AMD; 222
EEP; 20
ISBN
0-7918-1827-6
Conference
International Mechanical Engineering Congress and Exposition 1997  
Symposium on Application of Fracture Mechanics in Electronic Packaging 1997  
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