Title

SISPAD 2008, International Conference on Simulation of Semiconductor Processes and Devices

Title Supplement

September 9 - 11, 2008, Yumoto Fujiya Hotel, Hakone, JAPAN

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

New York, NY

Publication Date

2008

ISBN

978-1-4244-1753-7

Conference