Title

International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics & Micro System 2007. Vol.1

Title Supplement

London, United Kingdom, 15 - 18 April 2007

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2007

ISBN

1-4244-1105-X

1-4244-1106-8

Conference