Title

Processing, materials, and integration of damascene and 3D interconnects

Title Supplement
Symposium held during the 218th meeting of the Electrochemical Society, in Las Vegas, Nevada from October 10 to 15, 2010
Person Involved
Publisher
Publishing Place
Pennington, NJ
Publication Date
2010
Series
ECS transactions; 33, 12
ISBN
978-1-60768-181-6
978-1-56677-831-2
Conference