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Title
Special issue on design, test, integration and packaging of MEMS/MOEMS 2010
Title Supplement
The Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) was held in Seville, Spain, 5 - 7 May 2010
Person Involved
Publisher
Publishing Place
Berlin
Publication Date
2011
Series
Microsystem technologies; 17.2011, Nr.4
ISSN
0946-7076