Title

19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013

Title Supplement

Berlin, Germany, 25 - 27 September 2013

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2013

ISBN

978-1-4799-2271-0

978-1-4799-2273-4

Conference