Title

14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013

Title Supplement

14-17 April 2013, Wroclaw, Poland

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

New York, NY

Publication Date

2013

ISBN

978-1-4673-6138-5

978-1-4673-6139-2

Conference