Title

22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2023. Proceedings

Title Supplement
May 30 - June 2, 2023, Orlando, FL, USA
Corporate Author
Institute of Electrical and Electronics Engineers -IEEE-  
IEEE Electronics Packaging Society  
Publisher
Publication Date
2023
ISBN
979-8-3503-2167-8
979-8-3503-2166-1
979-8-3503-2165-4
DOI
Conference
Acronym
ITherm
Language
English