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Title
EMPC 2009, 17th European Microelectronics and Packaging Conference & Exhibition. CD-ROM
Title Supplement
June 15th-18th, 2009 , Rimini, Italy
Corporate Author
International Microelectronics and Packaging Society -IMAPS-, Italian Chapter
Institute of Electrical and Electronics Engineers -IEEE-
Publisher
Publishing Place
New York, NY
Publication Date
2009
ISBN
0-615-29868-0
978-0-615-29868-9
978-1-4244-4722-0