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21st European Microelectronics Packaging Conference, EMPC 2017. Proceedings
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Title
21st European Microelectronics Packaging Conference, EMPC 2017. Proceedings
Titel Supplements
Warsaw, 10-13 September 2017
Institut
Institute of Electrical and Electronics Engineers -IEEE-
International Microelectronics and Packaging Society -IMAPS-, Poland Chapter
Verlag
IEEE
Verlagsort
Piscataway, NJ
Datum
2017
Konferenz
European Microelectronics Packaging Conference (EMPC) 2017