Title

21st European Microelectronics Packaging Conference, EMPC 2017. Proceedings

Title Supplement

Warsaw, 10-13 September 2017

Person Involved

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

International Microelectronics and Packaging Society -IMAPS-, Poland Chapter

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2017

ISBN

978-0-9568086-4-6

978-1-5386-2309-1

Conference