Title

21st European Microelectronics Packaging Conference, EMPC 2017. Proceedings
Titel Supplements
Warsaw, 10-13 September 2017
Institut
Institute of Electrical and Electronics Engineers -IEEE-
International Microelectronics and Packaging Society -IMAPS-, Poland Chapter
Verlag
Verlagsort
Piscataway, NJ
Datum
2017
ISBN
978-0-9568086-4-6
978-1-5386-2309-1
Konferenz