Title

ASME InterPack Conference 2009. Proceedings. Vol.2

Title Supplement

Presented at 2009 ASME InterPack Conference, July 19 - 23, 2009, San Francisco, California, USA

Corporate Author

American Society of Mechanical Engineers -ASME-, Electronic and Photonic Packaging Division

Publisher

Publishing Place

New York/NY.

Publication Date

2010

ISBN

0-7918-4360-2

978-0-7918-4360-4

Conference