Title

International Conference on High Density Packaging and MCMs 1999. Proceedings

Title Supplement

April 6 - 9, 1999, The Adams's Mark Hotel, Denver, Colorado

Person Involved

Corporate Author

International Microelectronics and Packaging Society -IMAPS-

Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.

Publisher

Publishing Place

Reston, Va.

Publication Date

1999

Series

Proceedings of SPIE; 3830

ISBN

0-930815-57-2

Conference