Title

International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2016

Title Supplement

September 6-8, 2016, Nuremberg, Germany

Person Involved

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Deutsche Forschungsgemeinschaft -DFG-, Bonn

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2016

ISBN

978-1-5090-0818-6

978-1-5090-0816-2

978-1-5090-0819-3

978-1-5090-0817-9

Conference