Title

16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017

Title Supplement

May 30 - June 2, 2017, Walt Disney World Swan & Dolphin Hotel, Lake Buena Vista (Orlando) USA(Co-Located with ECTC)

Corporate Author

IEEE Components, Packaging, and Manufacturing Technology Society

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2017

ISBN

978-1-5090-2994-5

978-1-5090-2993-8

978-1-5090-2995-2

Conference